fLEX pcb FABRICATION

FLEX/RIGID-FLEX PCB FABRICATION SOLUTION

In response to the growing demand, In 2018 We created a dedicated FPC (Flex PCB, Flex Circuits ) factory to streamline the procurement process for relevant customers. As a one-stop PCB manufacturing service manufacturer, we pride ourselves on providing our customers with a one-stop PCB manufacturing solution, whether Rigid PCBs or Flex/Flex-Rigid PCBs, which helps reduce communication links, costs and lead times. Contact us today to learn more about our PCB manufacturing capabilities and how we can help you complete your project. We can provide you with various flexible circuit boards. You can rest assured that your flexible circuit or rigid flexible circuit product will be of high quality. Flexible circuits are widely used in many markets, including today: wearables, consumer electronics, medical devices, military, and aerospace. Common applications include: notebook computers, inkjet printers, hard drives, optical storage drives, mobile phones, video recorders, flat panel displays, etc.

Contact us today to learn more about our Flex/Rigid-Flex PCB Fabrication capabilities and how we can help you with your project.

HSTech PCB Technologies Co.,Ltd

FPC MATERIAL

FPC APPLICATION

FPC TYPES

Please contact us or send your Gerber data directly, and we will provide you with quotation in the shortest time. Your Queries with technologies is also welcome.

Item(项目)
Polyimide (PI) PET
Laminate Thickness(厚度)
0.025 / 0.050/ 0.125/ 0.175mm 0.025 / 0.050/ 0.075mm
Copper Foil(铜厚)
0.012,0.018,0.035,0.070mm 0.035,0.070mm
Min Pattern width/Space(线宽/线隙)
0.075(3 mil) 0.075(3 mil)
Min. Drilled Hole Size(最小孔径)
0.1mm+/-0.075mm 0.1mm+/-0.075mm
Outlines Dimension(外形公差)
+/- 0.05mm +/- 0.05mm
Peeling Strength(180°Direction)(剥离强度)
>1.2kgf / cm >1.2kgf / cm
Solder test(浸锡测试)
280℃ / 10secs/3cycles 280℃ / 10secs/3cycles
Surface finishing(表面处理) General Thickness(常规厚度)
Ni/Au
2~5μm 2~5μm
Au(Electro/Immersion)
0.03 ~0.1μm 0.03 ~0.1μm
Sn/Pb (Lead Free)
3~ 20μm 3~ 20μm
Sn-Cu Plating (Lead Free)
3~ 5μm 3~ 5μm
OSP
0.25-0.5um 0.25-0.5um
Tin Plating (Pure Sn)
5 ~ 8μm 5 ~ 8μm
Bending flexibility(弯折能力) Meet to IPC Criterion/Customer Specification
Chemical Resistance(耐化学性) Meet to IPC Criterion/Customer Specification
Stiffener Material(补强材料) General Thickness(常规厚度)
Polyimide (PI) 0.075mm, 0.1mm, 0.125mm, 0.15mm ,0.175mm, 0.2mm , 0.225mm, 0.25mm
FR4 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm~1.6mm
Stainless Steel(钢) 0.1mm, 0.2mm
Aluminum(铝) 1.0mm, 2.0mm (rarely used)